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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 20 tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 14 ? 001 voltage detector (reset) ic series for automotive application free time delay setting cmos voltage detector (reset) ic bd52xx- 2c series and bd53xx- 2c series general description rohm's bd52xx-2c and bd53xx-2c series are highly accurate, low current consumption voltage detector ics with a capacitor controlled time delay. the lineup includes n-channel open drain output (bd52xx-2c) and cmos output (bd53xx-2c) so that the users can select depending on the application. the devices are available for specific detection voltage ranging fro m 0.9v to 5.0v with 0.1v increment. the time delay has 5 0% accuracy in the overall operat ing temperature range of - 40 c to 125 c. special features ? aec -q100 qualified (note1) ? delay time setting controlled by external capacitor ? two output types (nch open drain and cmos output) ? ultra- low current consumption ? very small, lightweight and thin package ? package ssop5 is similar to sot- 23 -5 (jedec) (note1: grade 1) key specifications ? detection voltage: 0.9v to 5. 0 v (typ.) 0.1v step ? ultra-low current consumption: 0. 27a (typ.) ? time delay accuracy: 50% (- 40 c to + 125 c , ) ( ct pin capacitor 1nf ) special characteristics ? detection voltage accuracy: 3%12mv (v det =0.9v to 1.6v) 3% (v det =1.7v to 5.0v) package ssop 5: w(typ) x d(typ) x h(max) 2.90mm x 2.80mm x 1. 25mm application all automotive devices that requires voltage detection application circuit pin configuration ssop5 top view pin description ssop5 pin no. symbol function 1 vout output pin 2 vdd power supply voltage 3 gnd gnd 4 n.c. no connection pin 5 ct capacitor connectio n pin for output delay time setting figure 1. open drain output type bd52xx- 2c series figure 2. cmos output type bd53xx- 2c series vout vdd gnd n.c. ct lot no. marking v dd1 v dd2 gnd c ct r l bd52 xx -2c rst microcontroller n.c. pin is electrically open and can be connected to either vdd or gnd. v dd1 gnd c ct bd53 xx -2c rst microcontroller downloaded from: http:/// datashee t
2/ 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information line up output type open drain cmos detection voltage mark ing part number mark ing part number 5.0v 1z bd5250 90 bd5350 4.9v 1y bd5249 89 bd5349 4.8v 1x bd5248 88 bd5348 4.7v 1w bd5247 87 bd5347 4.6v 1v bd5246 86 bd5346 4.5v 1u bd5245 85 bd5345 4.4v 1t bd5244 84 bd5344 4.3v 1s bd5243 83 bd5343 4.2v 1r bd5242 82 bd5342 4.1v 1q bd5241 81 bd5341 4.0v 1p bd5240 80 bd5340 3.9v 1n bd5239 79 bd5339 3.8v 08 bd5238 78 bd5338 3.7v 07 bd5237 77 bd5337 3.6v 06 bd5236 76 bd5336 3.5v 05 bd5235 75 bd5335 3.4v 04 bd5234 74 bd5334 3.3v 03 bd5233 73 bd5333 3.2v 02 bd5232 72 bd5332 3.1v 01 bd5231 71 bd5331 3.0v 5g bd5230 70 bd5330 2.9v z9 bd5229 69 bd5329 2.8v z8 bd5228 68 bd5328 2.7v z7 bd5227 67 bd5327 2.6v xs bd5226 66 bd5326 2.5v xr bd5225 65 bd5325 2.4v 24 bd5224 64 bd5324 2.3v 23 bd5223 63 bd5323 2.2v 22 bd5222 62 bd53 22 2.1v 21 bd5221 61 bd53 21 2.0v 20 bd5220 60 bd53 20 1.9v 19 bd52 19 59 bd53 19 1.8v 18 bd52 18 58 bd53 18 1.7v 17 bd52 17 57 bd53 17 1.6v 16 bd52 16 56 bd53 16 1.5v 15 bd52 15 55 bd53 15 1.4v 14 bd52 14 54 bd53 14 1.3v 13 bd52 13 53 bd53 13 1.2v 12 bd52 12 52 bd53 12 1.1v 11 bd52 11 51 bd53 11 1.0v 10 bd52 10 5f bd53 10 0.9v 09 bd52 09 5e bd5309 part output type detection voltage package product rank packaging and forming specification number 52 : open drain 09 : 0.9v g : ssop5 c : for automotive tr : embossed tape and reel 53 : cmos 0.1v step 50 : 5.0v b d x x - t r x x x c 2 downloaded from: http:///
3/ 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum rating s (ta=- 40 c to +125c) parameter symbol limit unit power supply voltage v dd gnd -0.3 to +7 v output voltage nch open drain output v out gnd-0.3 to +7 v cmos output gnd-0.3 to v dd +0.3 output current io 70 ma operating temperature range topr -40 to +1 25 c junction temperature range tj - 40 to +1 50 c storage temperature range tstg -55 to +150 c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fu se, in case the ic is operated over the absolute maximum ratings. thermal resistance (note 1) parameter symbol thermal resistance (typ) unit 1s (note 3) 2s2p ( note 4) ssop5 junction to ambient ja 376.5 185.4 c /w junction to top characterization parameter (note 2) jt 40 30 c /w (note 1) based on jesd51-2a(still-air). (note 2) the thermal characterization parameter to report the differen ce between junction temperature and the temperature at the top cen ter of the outside surface of the component package. (note 3) using a pcb board based on jesd51- 3. layer number of measurement board material board size single fr -4 114.3mm x 76.2mm x 1.57mm top copper pattern thickness footprints and traces 70 m (note 4) using a pcb board based on jesd51- 7. layer number of measurement board material board size 4 layers fr -4 114.3mm x 76.2mm x 1.6mm top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m downloaded from: http:///
4/ 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified ta=- 40 c to +125 c , vdd=0.8v to 6v ) parameter symbol condition limit unit min typ max detection voltage v det v det =0.9v to 1.6v , v dd =h ? l, r l = 100k ? v det (t) 0.97 -0.0 12 v det (t) v det (t) 1.03 +0.0 12 v v det =1.7v to 5.0v , v dd =h ? l, r l = 100k ? v det (t) 0.97 v det (t) v det (t) 1.03 hysteresis voltage ? v det v dd =l ? h ? l, r l = 100k ? v det 0.03 v det 0.05 v det 0.07 v circuit current when on i dd1 v dd = v det -0.2v - 0. 23 1.50 a circuit current when off i dd2 v dd = v det + 0. 5v - 0.27 1. 60 a operating voltage range v opl v ol 0.4v, ta=- 40 c to 125c , r l = 100k ? 0.80 - - v l ow output voltage (nch) v ol v dd =0.8v, isink = 0.17 ma , v det =0.9v to 1.6v - - 0.4 v v dd =1.2v, isink = 1.0ma , v det =1.7v to 5.0v - - 0. 4 v dd =2.4v, isink = 2.0ma , v det =2.7v to 5.0v - - 0. 4 h igh output voltage (pch) v oh v dd =4.8v, isource=2.0ma, v det (0.9v to 4.2v) v dd - 0. 4 - - v v dd =6.0v, isource= 2. 5ma, v det (0.9v to 5.0v) v dd - 0. 4 - - output leak current (bd52xx) i leak v dd = v ds =6v - - 1.0 a delay time (l h) t plh v out gnd 50% , ct=0.01 f note 1 note 2 27.7 55.5 83.2 ms v det (t) : standard detection voltage(0.9v to 5.0v, 0.1v step) r l : pull-up resistor to be connected between v out and power supply. note 1 t plh : v dd = (v det (t) C 0.1 v (v det (t)+0.5v) for v det =0.9v to 1.2v t plh : v dd =(v det (t) C0.5v (v det (t)+0.5v) for v det =1.3v to 5.0v note 2 ct delay capacitor range: open to 4.7 f. downloaded from: http:///
5/ 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 block diagram figure 3. bd52 xx -2c series figure 4. bd53 xx -2c series *1 *1 *1 vout vref vdd gnd ct delay circuit delay circuit *1 : parasitic diode vout vref vdd gnd ct delay circuit *1 *1 *1 *1 delay circuit *1 : parasitic diode downloaded from: http:///
6/ 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 1 2 3 4 5 6 circuit current : i dd ( a) supply voltage : v dd (v) figure 5. circuit current vs. v dd typical performance curves ta=125c ta=105c ta=25c ta=- 40 c bd52 09 g- 2c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 1 2 3 4 5 6 circuit current : i dd ( a) supply voltage : v dd (v) figure 7. circuit current vs. v dd bd52 30 g- 2c ta=125c ta=105c ta=25c ta=- 40 c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 -40 -25 -10 5 20 35 50 65 80 95 110 125 circuit current : i dd ( a) temperature : ta ( c) figure 8. circuit current vs. temp bd52 30 g- 2c v dd =v det +0.5v v dd =v det -0.2v 0.0 0.1 0.2 0.3 0.4 0.5 0.6 -40 -25 -10 5 20 35 50 65 80 95 110 125 circuit current : i dd ( a) temperature : ta ( c) figure 6. circuit current vs. temp v dd =v det +0.5v v dd =v det -0.2v bd52 09 g- 2c downloaded from: http:///
7/ 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.7 0.8 0.9 1.0 1.1 1.2 output voltage : v out (v) supply voltage : v dd (v) figure 11. detection voltage bd52 09 g- 2c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 1 2 3 4 5 6 circuit current : i dd ( a) supply voltage : v dd (v) figure 9. circuit current vs. v dd ta=125c ta=105c ta=25c ta=- 40 c bd52 50 g- 2c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 -40 -25 -10 5 20 35 50 65 80 95 110 125 circuit current : i dd ( a) temperature : ta ( c) figure 10. circuit current vs. temp v dd =v det +0.5v v dd =v det -0.2v bd52 50 g- 2c 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 -40 -25 -10 5 20 35 50 65 80 95 110 125 detection voltage : v det (v) temperature : ta ( c) figure 12. detection voltage and release voltage v det + v det v de t bd5209g- 2c downloaded from: http:///
8/ 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 output voltage : v out (v) supply voltage : v dd (v) figure 13. detection voltage bd52 30 g- 2c 0.0 1.0 2.0 3.0 4.0 5.0 6.0 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 5.6 output voltage : v out (v) supply voltage : v dd (v) figure 15. detection voltage bd52 50 g- 2c bc 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 5.6 -40 -25 -10 5 20 35 50 65 80 95 110 125 detection voltage : v det (v) temperature : ta ( c) figure 16. detection voltage and release voltage v det + v det v de t bd52 50 g- 2c 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 -40 -25 -10 5 20 35 50 65 80 95 110 125 detection voltage : v det (v) temperature : ta ( c) figure 14. detection voltage and release voltage v det + v det v de t bd52 30 g- 2c downloaded from: http:///
9/ 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 output voltage : v out (v) supply voltage : v dd (v) figure 17. i/o characteristics pull-up to 5v pull- up resistance: 100k ta=125c ta=105c ta=25c ta=- 40 c bd5230g- 2c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 output voltage : v out (v) supply voltage : v dd (v) figure 18. i/o characteristics pull-up to vdd pull- up resistance: 100k ta=125c ta=105c ta=25c ta=- 40 c bd5230g- 2c 0.0 0.2 0.4 0.6 0.8 1.0 -40 -25 -10 5 20 35 50 65 80 95 110 125 minimum operating voltage: v opl (v) temperature : ta ( c) figure 19. operating limit voltage pull-up to 5v pull- up resistance: 100k 0.0 0.2 0.4 0.6 0.8 1.0 -40 -25 -10 5 20 35 50 65 80 95 110 125 minimum operating voltage: v opl (v) temperature : ta ( c) figure 20. operating limit voltage pull-up to vdd pull- up resistance: 100k downloaded from: http:///
10 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0 10 20 30 40 50 60 70 0.0 1.0 2.0 3.0 4.0 5.0 "high" output current : i oh (ma) drain-source voltage : v ds (v) figure 21. high output current typical performance curves - continued v dd = 1.2v bd5 309 g- 2c v dd = 2v v dd = 3v v dd = 4v 0 10 20 30 40 50 60 70 0.0 0.5 1.0 1.5 2.0 2.5 3.0 "low" output current : i ol (ma) drain-source voltage : v ds (v) figure 22. low output current v dd = 2v v dd = 1.2v v dd = 0.85v bd5 250 g- 2c 0 10 20 30 40 50 60 70 0.0 0.5 1.0 1.5 2.0 2.5 3.0 "low" output current : i ol (ma) supply voltage : v dd (v) figure 24. low output current (v ds =0.5v) ta=125c ta=105c ta=25c ta=- 40 c bd522 0g - 2c 0 5 10 15 20 25 30 35 0.0 1.0 2.0 3.0 4.0 5.0 6.0 "high" output current : i oh (ma) supply voltage : v dd (v) figure 23. high output current (v ds =0.5v) bd5 309 g- 2c ta=125c ta=105c ta=25c ta=- 40 c downloaded from: http:///
11 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0 10 20 30 40 50 60 70 0.0001 0.001 0.01 0.1 1 10 delay time (h~l) : t phl ( s) ct pin capacitance : c ct (f) figure 28. output delay time (h~l) typical performance curves - continued 0 10 20 30 40 50 60 70 -40 -25 -10 5 20 35 50 65 80 95 110 125 delay time (h~l) : t phl ( s) temperature : ta ( c) figure 26. output delay time (h~l) 0 10 20 30 40 50 60 70 80 -40 -25 -10 5 20 35 50 65 80 95 110 125 delay time (l~h) : t plh (ms) temperature : ta ( c) figure 25. output delay time (l~h) c ct =4.7nf c ct =10 nf 0.1 1 10 100 1000 10000 100000 0.0001 0.001 0.01 0.1 1 10 delay time (l~h) : t plh (ms) ct pin capacitance : c ct ( f ) figure 27. output delay time (l~h) ta=125c ta=105c ta=25c ta=- 40 c downloaded from: http:///
12 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 application information 1. explanation of operation for both the open drain type (figure 29 ) and the cmos output type (figure 30 ), the detection and release voltages are used as threshold voltages. when the voltage appli ed to the vdd pin reaches the applicable threshold voltag e, the vout pin voltage switches from either high to low or from low to high. bd52 xx - 2c series and bd53 xx - 2c series have delay time function which set t plh (output low to high using an external capacitor connected in ct pin (c ct ). because the bd52 xx -2c series uses an open drain output type, it is necessary to connect a pull up resistor to v dd or another power supply if needed [the output high voltage (v out ) in this case becomes v dd or the voltage of the other power supply]. 2. setting of detector delay time delay time l~h (t plh ) is the time when v out rises to 1/2 of v dd after v dd rises up and beyond the release voltage (v det +?v det ). the delay time (t plh ) at the rise of v dd is determined by delay coefficient, ct capacitor and delay time when ct pin is open (t ct o ) and calculated from the following formula. when ct capacitor 1n f, t ct o has less effect and t plh computation is shown on example no.2. the result has 50% tolerance within the operating temperature range of -40c to +125c formula : ( ta=25c) ?? = ?? ?? ??? + ?? [s] where: c ct is the ct pin external capacitor delay coefficient is equal to 5.55 x 10 6 t ct o is the delay time when ct=open note1 note1: t ct o is design guarantee only; outgoing inspection is not done on all p roducts. example no.1: ct capacitor = 100pf ?? _? = ? . 6 . + ?6 = ?? _?? = ? . 6 . + ?6 = ?? _ ? = ? . 6 . + ?6 = example no.2: ct capacitor = 1nf ?? _?? = ?9 . 6 = . temperature delay time (t cto ) min typ max ta = -40c to +125c 15 s 50 s 150 s figure 29. (bd52xx- 2c type internal block diagram) figure 30. (bd53xx- 2c type internal block diagram) vout vref vdd gnd ct delay circuit vout vref vdd gnd ct delay circuit downloaded from: http:///
13 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 3. timing waveform the following shows the relationship between the input voltag e v dd and the output voltage v out when the power supply voltage v dd is sweep up and sweep down. when the power supply turns on , the output voltage (v out ) is undefined until v dd overcomes the operating voltage limit (v opl ). v out will turn to low as v dd increases above v opl but less than the release voltage (v det + v det ) , when v dd exceeds the release voltage (v det + v det ) , delay time (t plh ) set by capacitor at ct pin (c ct ) will happen then v out will switch from low to high. v out will remain high until v dd do not fall below the detection voltage (v det ). when v dd drops below v det , v out will switch from high to low with a delay of t phl . * the potential difference between the detection voltage and the rel ease voltage is known as the hysteresis voltage width (?v det ). the system is designed such that the output will not toggl e with power supply fluctuations within this hysteresis width, preventing malfunctions due to no ise. figure 31. bd52 xx -2c set- up figure 32. timing diagram v det v det +v det v opl : < 0.8v t v dd t v out t plh undefined undefined hysteresis voltage ( v det ) t phl t plh t phl vout vref vdd gnd ct delay circuit r l v dd c ct downloaded from: http:///
14 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 4. circuit applications (1) examples of common application circuits application examples of bd52 xx -2c series (open-drain output type) and bd53 xx -2c series (cmos output type) are shown below. case1: power supply of the microcontroller (v dd2 ) differs from the power supply of the reset detection (v dd1 ). use an open drain output type (bd52 xx -2c) device with a load resistance r l attached as shown in figure 33 . case2: power supply of the microcontroller (v dd1 ) is the same as the power supply of the reset detection (v dd1 ). use a cmos output type (bd53 xx -2c) device or an open -drain output type (bd52 xx -2c) device with a pull - up resistor between the output and v dd1 . (2) the following is an example of circuit application i n which an or connection between two types of detection vo ltage resets the microcontroller. to reset the microcontroller when many independent power supplies are used in the system, or connect an open drain output type (bd52xx- 2c series to the microcontrollers input with pull -up resistor to the supply voltage of the microcontroller (v dd3 ) as shown in figure 35 . by pulling-up to v dd3 , output high voltage of micro -controller power supply is possible. v dd1 bd52xx-2c v dd2 gnd c ct r l rst microcontroller figure 33. open drain output type figure 34. cmos output type v dd1 v dd3 gnd c ct r l v dd2 c ct bd52 xx -2c no.1 bd52 xx -2c no.2 microcontroller rst figure 35. or circuit connection application v dd1 bd53xx-2c gnd c ct rst microcontroller downloaded from: http:///
15 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 circuit applications (continued) (3) examples of the power supply with resistor dividers in applications wherein the power supply voltage of an ic comes from a resistor divider circuit, an inrush current wil l flow into the circuit when the output level switches from low to high or vice vers a. inrush current is a sudden surge of current that flows from the power supply (v dd ) to ground (gnd) as the output logic changes its state. this current flow may cause malfunction in the systems operation such as output oscillations, etc. figure 36 . resistor divider connection application figure 37. v dd voltage vs. current consumption a voltage drop [inrush current (i 1 )] [input resistor (r a )] is caused by the inrush current, and causes the input voltage to drop when the output switches from low to high . when the input voltage decreases and falls below the detection voltage, the output voltage switches from high to low . at this time, th e in rush current stops flowing through output low , and the voltage drop is reduced. as a result, the output switches from low to high , which again causes the inrush current to flow and the voltage to drop. this operation repeats and will result to oscillati on. in case resistor divider will not use and only r a will use, same response will happen. note1: the circuit connection mentioned above does not guarantee successful operation. please perform thorough evaluation using the actual applicati on and set countermeasures v dd 0 i dd v det inrush current 0.1 1.0 10.0 100.0 1.0 2.0 3.0 4.0 5.0 6.0 inrush current : i dd (a) supply voltage : v dd (v) figure 38. i dd inrush current ta=25c bd5 309 g- 2c 0 10 20 30 40 50 60 70 80 90 100 -40 -25 -10 5 20 35 50 65 80 95 110 125 inrush current : i dd (a) temperature : ta ( c) figure 39. i dd inrush current v dd =6v bd5 309 g- 2c (note 1) c vdd (c vdd 0.1f v out (note 1) r a (r a 100kohm) v dd bd52xx-2c bd53xx-2c gnd r b i 1 v 1 downloaded from: http:///
16 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 circuit applications (continued) depending on the application set- up , there are times that v dd voltage is always below the release voltage (v det + v det ) because of the effect of in ru sh current as shown in figure 40. figure 40. v dd drop caused by inrush current v det v det + v det t voltage v 1 hysteresis voltage ( v det ) v dd v drop = in rush current x r a downloaded from: http:///
17 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external dio de between the power supply and the ics power supply pins . 2. power supply line de sign the pcb layout pattern to provide low impedance supply line s. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacita nce value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-sig nal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the power supply and ground lines m ust be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature ra ting be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the exp ected characteristics of the ic can be approximately obtai ned. the electrical characteristics are guaranteed under the conditi ons of each parameter. 7. inr ush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence an d delays, especially if the ic has more than one power supp ly. therefore, give special consideration to power coupling cap acitance, power wiring, width of gnd wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacito r directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after e ach process or step. the ics power supply should always be turned off completely before connecting or removi ng it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charg e acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifie d, unused input pins should be connected to the power supply or ground line downloaded from: http:///
18 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 12. regarding input pins of the ic in the construction of this ic, p- n junctions are inevitably formed creating parasitic diode s or transistors. the operation of these parasitic elements can result in mutual interferenc e among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements t o operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not ap ply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supply volta ge is applied, make sure that the input pins have voltag es within the values specified in the electrical characteristics of this ic 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and t he maximum junction temperature rating are all within the area of safe operation (aso). 15. bypass capacitor for noise rejection to help reject noise, put more than 0. 1f capacitor between vdd pin and gnd. be careful when using extremely big capacitor as transient response will be affected. 16. the v dd line impedance might cause oscillation because of the dete ction current. 17. a v dd to gnd capacitor (as close connection as possible) should be use d in high v dd line impedance condition. 18. external parameters the recommended value of c t capacitor is from open to 4.7 f and pull- up resistance value is 50k to 1m . there are many factors (board layout, etc) that can affect characteristic s. operating beyond the recommended values does not guarantee correct operation. please verify and confirm using practi cal applications. 19. when v dd falls below the minimum operating voltage, output will be open. when output is connected to pull-up voltage , output will be equivalent to pull-up voltage. 20. power-on reset operation please note that the power on reset output varies with the v dd rise time. please verify the behavior in the actual operation. 21. ct pin discharge due to the capabilities of the ct pin discharge transistor, the ct pin may not completely discharge when a short input pulse is applied, and in this case the delay time may not be controlled. please verify the actual operation. 22. this ic has extremely high impedance pins. small leak c urrent due to the uncleanness of pcb surface might cause unexpected operations. application values in these condi tions should be selected carefully. if 10m? leakage is a ssumed between the ct and gnd pin , it is recommended to insert 1m? resist or between ct and vdd pin . however, delay time will change when resistor is connected externally to ct pin so verify the delay time requirements when using th is set-up. also, when similar leakage is assumed between vout and g nd pin, consider to set the value of pull up resistor lower than 1/10 of the impedance of assumed leakage route. downloaded from: http:///
19 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 external dimension diagram, packaging and forming specification package name ssop5 downloaded from: http:///
20 / 20 bd52 xx - 2c series bd53 xx - 2c series tsz02201-0r7r0g300200-1-2 ? 20 16 rohm co., ltd. all rights reserved. 25.apr.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 201 6/04/25 001 new downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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